Cluster-type sputtering device CLUSTERLINE 200
200mm cluster-type sputtering system compatible with thin wafer transport, backside metallization, and piezoelectric materials.
The "CLUSTERLINE 200" is a cluster-type sputtering system designed for 200mm wafers. It features a cluster architecture with cassette-to-cassette processing and fully automated substrate transport. It supports the transport of thin wafers, backside metallization, film formation of new piezoelectric materials such as AlScN, and precision film formation for NIR bandpass filters for consumer devices. Additionally, the new PEALD module for the CLUSTERLINE 200 enables ultra-thin and highly conformal film deposition with atomic-level thickness control, even for complex shapes. *For more details, please feel free to contact us.*
- Company：Evatec Japan Ltd.
- Price：Other
